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용 도
Ultrasonic Soldering Station은 열과 초음파진동을 기반으로 하는 새로운 방식의 납땜 장비입니다.
유도된 Cavitation 효과로 연기와 오염물질을 배출하지 않아, Flux 사용 및 작업 종료 후 청소할 필요가 없으며, glass 기판을 비롯하여, 유기물질을 제외한 거의 모든 물질에 납땜이 가능한 장비입니다.
현재 많은 연구기관 및 대학교 연구실, 기업 등에서 사용하고 있는 Lab. 장비입니다.
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DESCRIPTION & BENEFITS
In the past, flux and heating were the typical method to be used for soldering, but special new generation solderers, as Ultrasonic Soldering Station, introduce a new type of soldering, based on heat and ultrasonic vibrations. The induced cavitation effect replaces usage of flux as well as the cleaning process, since there is no exhaust fumes and pollution. By combining this device with peculiar solder alloys, the customer can solder on almost of all the materials, for example glass, ceramics, aluminium, molybdenum etc. (except for low melting organic substances) The Ultrasonic Soldering Station can be mounted tips from 1 mm to 4 mm adjustable by 0.5 mm unit, with a 45° tapered cut or straight form.
CHARACTERISTICS
User-friendly interface
New feed-back method developed from careful research of oscillator frequency settings enables stable, reliable work.
Output adjustable by stepless control
Temperature can be set within 200°C 500°C by 10°C unit.
Temperature ascend time: 1 min to 400 min
Frequency, power output and temperature can read out from a display and easily replicated when necessary.
Small, compact design enables easy changes of working station.
Suitable for use abroad, with AC ranging from 100V to 240V.
APPLICATIONS
Small scale production.
For use in laboratory conditions, while preparing data before mass production and for inspection purposes.
Soldering electrodes for display goods.
Soldering electrodes for solar cells.
Soldering electrodes on highly conductive ceramic substrates. Bonding electronic parts.
EL lighting.
Soldering electrodes on highly conductive ceramic substrates. Bonding electronic parts.
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